If you’re an architect, designer, or anyone in the AEC profession who wants to be on the cutting edge of facade design and fabrication, don’t miss this Symposium.

 

SYMPOSIUM

8 LU/HSW credits

Thursday, July  26th 2012  8:00 AM – 5:00 PM
UCSF Mission Bay Conference Center  San Francisco, California

KEYNOTE SPEAKER CRAIG DYKERS, Principal/Founding Partner Snøhetta

PRESENTERS PETER ARBOUR seele  KEITH BOSWELL Skidmore Owings & Merrill  MARK E. DANNETTEL Thornton Thomasetti  CURT FRIEDHOLDT Firestone Building Products LISA IWAMOTO IwamotoScott  JASON KELLY JOHNSON Future Cities Lab/California College of the Arts  HAO KO Gensler  BILL KREYSLER Kreysler & Associates  ANDREW KUDLESS Matsys/California College of the Arts  CHRIS LASCH Aranda\Lasch  ARNOLD LEE HOK  MIC PATTERSON Enclos, Corp.  M. MIN RA Front  GEOFF ROSSI Element  DENNIS SHELDEN Gehry Technologies  ANN SMITH Cambridge Architectural  MARCELLO SPINA P-A-T-T-E-R-N-S  SANJEEV TANKHA Buro Happold  BEN TRANEL Gensler  PHIL WILLIAMS Webcor Builders & Consulting Group

 

DIGITAL FABRICATION WORKSHOPS

8 LU/HSW or 8 LU credits (depending upon workshop choice)

Friday, July  27th 2012  9:00 AM – 6:00 PM
California College of the Arts  San Francisco, California

PARAMETRIC ENVELOPES WITH GRASSHOPPER
ANDREW KUDLESS Matsys Design/California College of the Arts

COMPOSITE FACADES IN ARCHITECTURE
BILL KREYSLER & JOSHUA ZABEL Kreysler & Associates

RESPONSIVE BUILDING FACADES
JASON KELLY JOHNSON Future Cities Lab/California College of the Arts

SCRIPTED FACADES
CHRIS LASCH Aranda/Lasch

PARAMETRIC FACADE TECTONICS
KEVIN MCCLELLAN & ANDREW VRANA Digital Fabrication Alliance

 

Facade technologies are developing at a more dynamic rate than almost any other issue related to construction today with an impact on performance, sustainability, materials, fabrication, design, delivery and much more. What was once thought impossible is now an everyday reality, and the future promises accelerating change.

 

Presented by Enclos and The Architect’s Newspaper, COLLABORATION will bring together in a two-day event, the industry, the profession, and the academy to explore the evolution and the issues surrounding today’s high tech building envelope through case studies and lectures presented by foremost

practitioners, as well as panel discussions, and workshops conducted by leaders in the AEC profession.

 

Aimed at architects, building owners and developers, general contractors, engineers, fabricators, material suppliers, educators, and students, the event’s panels and sessions address the transformative opportunities created by new technologies and resources. From using BIM for communicating effectively with fabricators, to energy modeling, to retrofitting practices and the latest design tools, the COLLABORATION conference offers an unprecedented opportunity to survey the possibilities of designing in the digital age.

 

Who Should Attend

Architects, designers, engineers, building owners, developers, and facade consultants interested in gaining increased understanding of cutting-edge building envelope technologies.

Sponsored by:

CLICK HERE TO REGISTER


SF

JULY 2012


CHI

OCTOBER 2012